发明名称 INTEGRATION TRANSIT STRUCTURE FROM MICROSTRIP TO SUSPENSION STRIP LINE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide the structure of transiting a microstrip to a suspension strip line to modify impedance while minimizing electric discontinuity and its manufacture which are suitable for a microwave hardware not affected by an error of matching registration. SOLUTION: By the integration transit structure from a microstrip 14 into a suspension strip line 24 and its manufacture method, the transmission line is transited from the microstrip 14 into the suspension strip line 24 without minimizing the electric discontinuity due to mis-matching and without being affected thereby. A conductor 10 has a prescribed width and air gaps 44, 42 gradually tapered thin in ground planes 36, 38 act like the suspension strip line 24. The gaps 44, 42 gradually tapered thin conduct impedance conversion and minimize the discontinuity during transition due to a manufacture tolerance.
申请公布号 JPH09246813(A) 申请公布日期 1997.09.19
申请号 JP19970063991 申请日期 1997.03.04
申请人 MOTOROLA INC 发明人 KENESU BAAN BUUA;DEBITSUDO WAREN KOOMAN
分类号 H01P3/08;H01P5/02;H01P5/08;H01P11/00 主分类号 H01P3/08
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