| 摘要 |
PROBLEM TO BE SOLVED: To provide a work treatment apparatus capable of accurately detecting a particle generating mechanism in a wafer process. SOLUTION: A work treatment, apparatus has a treatment chamber 1 applying a predetermined treatment to a semiconductor wafer W, a plurality of laser beam sources 4a, 4b, 4c arranged to the treatment chamber 1 in an up and down direction and emitting laser beams into the treatment chamber 1 while scanned in a horizontal direction, the detector 8 arranged in the treatment chamber 1 to detect the laser beams L scattered by the particles P in the treatment chamber 1 and laser beam permeable windows 6a, 6b, 6c preventing the detection of straightly advancing laser beams L by the detector 8. A light wavelength separation filter 10 introducing only the laser beams L into the detector 8 is arranged to the treatment chamber 1. |
