SEMICONDUCTOR INTEGRATED CIRCUIT SUBSTRATE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To specify the chip coordinate of individual chips after cutting a semiconductor integrated circuit substrate. SOLUTION: Concentric circles 10 to 14 centering an origin 3 are formed on the back side of a wafer 1. The stroke width of the concentric circles 10 to 14 is varied in accordance with the quadrant of coordinate defined by an X-axis 4 and a Y-axis 5. A circular arc expressed on the back side of an LSI chip 2 cut out of the wafer 1 is read by a known optical system. The quadrant of the chip 2 in the wafer 1 is found from the stroke width, and the distance from the origin 3 is found from the curvature of the circular arc. The angle made by the X-axis 4 and a line which is normal to a tangent to the circular arc and has a length equal to the previously found distance is found. From these data of quadrant, distance and angle, the chip coordinate of the LSI chip 2 in the wafer 1 is determined.