发明名称 MOLD FOR MOLDING SEMICONDUCTOR DEVICE AND MANUFACTURE OF MOLDED SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To easily avoid the positional deviation of corresponding upper and lower chasing molds by engaging both the molds corresponding to both die sets to be mounted with a clearance for allowing the movement of the molds. SOLUTION: Clearances 7a, 7b of 0.1mm or less are provided between a chase mold 1 and a die set 2 and between a chase mold 3 and a die set 4 in the state that the molds 1, 3 corresponding to the sets 2, 4 are engaged to be mounted. The state that a gap of 0.1mm or less or preferably 0.01 to 0.07mm in a vertical direction or 0.1mm or preferably 0.05 to 0.08mm in a side direction is retained is adopted. The molds 1, 3 have a clearance to make it possible to move longitudinally or laterally in the state engaged with the sets 2, 4. To hold the engaging state, a bolt 8a with a seat for restricting the clamping is formed to facilitate the clearance at the bottom or upper surface side of the set as a suppressing tool.
申请公布号 JPH09246304(A) 申请公布日期 1997.09.19
申请号 JP19960055222 申请日期 1996.03.12
申请人 TOSHIBA CORP 发明人 OKUBO TADANORI
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/26
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