| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to form fine resist patterns with good accuracy and to effectively prevent a development defect by executing the discharge of a developer dividely to plural times. SOLUTION: A wafer 1 formed with the exposed resist to be developed is held on a wafer chuck 2 and the wafer chuck 2 is rotated by means of a motor 4. Next, the developing nozzle 6 at the front end of a developing nozzle arm 5 is moved near to the center of the wafer 1 by the developing nozzle arm and the developer is discharged onto the wafer 1 from the developing nozzle 6. After the discharge of the developer is executed once, the discharge of the developer is stopped and the rotation of the wafer 1 is stopped. The wafer 1 is rotated again after the stop for the arbitrary time and immediately thereafter, the rotation of the wafer 1 is stopped. The rotation and stop of the high acceleration of the wafer 1 are repeated the required number of times at every arbitrary time. As a result, the microbubbles adhered on the surface of the resist on the wafer 1 at the time of building up by the discharge of the developer are removed outside the wafer 1. |
