| 摘要 |
PROBLEM TO BE SOLVED: To reduce with certainty the suction error of a wafer even when the direction of the surface of wafer to be transferred is somewhat irregular. SOLUTION: An arm, which, is inserted into a container to perform a wafer transfer operation, is slowly moved to the prescribed position in the state that the sucking surface is directed to the wafer to be taken out. If the suction of the wafer is not confirmed (S1 to S3) even when the arm is moved in maximum permissible distance Xmax , the microscopic movement directed to the wafer from the prescribed position (original point) is repeated until the suction of the wafer is confirmed while the direction of sucking surface of the arm is rotated at the prescribed angleθ1 andθ2 to the left-right and up-down directions in the range of maximum angle for one direction.
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