发明名称 MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To control a diffusion of dopants in a polycrystalline silicon film into a substrate with high accuracy in a DRAM of a structure that the lower electrode of a capacitance element for storing information on a memory cell is constituted of this polycrystalline silicon film. SOLUTION: Connection holes 19, which respectively reach the N<-> semiconductor region 9A on one side of N<-> semiconductor regions 9A of each MISFET Qt for memory cell selection use, are formed and thereafter, a lightly doped (or non-doped) polycrystalline silicon film 16 is deposited on a semiconductor substrate 1 by a CVD method, then, N-type impurities (phosphorus or arsenic) are implanted in the surface layer part of this film 16 to heighten the impurity concentration in the surface layer part only. The substrate 1 is heat-treated and the N-type impuriites in the film 16 are diffused in a P-type well 2 through the holes 19, whereby N<+> semiconductor regions 9B are formed.
申请公布号 JPH09246493(A) 申请公布日期 1997.09.19
申请号 JP19960056316 申请日期 1996.03.13
申请人 HITACHI LTD 发明人 ASAKURA HISAO;TADAKI YOSHITAKA;SEKIGUCHI TOSHIHIRO
分类号 H01L21/28;H01L21/225;H01L21/8242;H01L27/108 主分类号 H01L21/28
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