| 摘要 |
PROBLEM TO BE SOLVED: To improve contactability between a substrate and electrode lead-out lead terminals, and a sealing resin, by providing a groove on a lateral side of the substrate and on at least one of the electrode lead-out lead terminals. SOLUTION: In a lead frame 1 for a semiconductor device, a V-shaped groove 7 is provided on a lateral side of a substrate 13 having a die pad portion 5 for mounting a transistor chip thereon, and two V-shaped grooves 8 are provided around electrode lead-out lead terminals 3, 4. The V-shaped groove 7 is formed by punching out the shape of the lead frame 1 from a metal material of variable shape by pressing, and then performing V-shape crushing to the lateral side of the die pad portion 5 and V-shape crushing to the lead terminals 3, 4. Thus, the lead frame 1 for a semiconductor device of high reliability may be provided in which contactability between the lateral side of the substrate 13 having the die pad portion 5 for mounting a transistor thereon and the electrode lead- out lead terminals 3, 4, and a sealing resin, is improved. |
