| 摘要 |
PROBLEM TO BE SOLVED: To prevent the deviation of a polished object such as a semiconductor and to improve polishing uniformity on the polished face of the polished object. SOLUTION: A polishing disk 3 having a polishing pad 4 on a surface 3a and rotated at the time of polishing, a wafer carrier provided with a pressing face 6b for pressing the back 1c of the semiconductor wafer 1, a guide ring 5 which is provided with an inner peripheral face 5a for guiding the outer peripheral part 1b of the semiconductor wafer 1 and forms a wafer storage space 14 constituted of the pressing face 6b of a wafer carrier 6 and the inner peripheral face 5a by making the ring fit to the wafer carrier 6, a polishing disk rotation means for rotating the polishing disk 3 and a carrier rotation means for rotating the wafer carrier 6 are provided. The depth 14a of the wafer storage space 4 is almost equal or deeper to/than the thickness 1d of the semiconductor wafer 1. At the time of polishing the semiconductor wafer 1, the end face 5e of the guide ring 5 and the polished face 1a of the semiconductor wafer 1 form the almost same face. |
