发明名称 PHOTOELECTRIC INTEGRATED PACKAGE HAVING CARRIER RING AND ITS PRODUCTION
摘要 PROBLEM TO BE SOLVED: To form the arrays of light emitting elements (LEDs) for cooperatively forming complete images on an optical transparent substrate and forming LED display chips by the same. SOLUTION: The LEDs 12 are arranged in a matrix and the adjacent positions at the outer edges of the substrate 10 are provided with electrical junctures. Driver boards are provided with embedded conductors, plating through-hole biers and/or embedded lead frames for connection to the LEDs 12 of the LED display chips. Further, many drivers and control circuits are connected to the driver boards and the LEDs 12. Molded carrier rings are electrically connected to the driver boards, the LED display chips and the drivers and control circuits. Molded refractive or diffractive lenses are arranged on the surface on the side opposite to the LED display chips so as to be aligned to the arrays 15 of the LEDs 12 of the LED display chips, by which the images are magnified and the easily visible virtual images are formed.
申请公布号 JPH09244552(A) 申请公布日期 1997.09.19
申请号 JP19970063941 申请日期 1997.03.04
申请人 MOTOROLA INC 发明人 MAIKERU ESU REBII;FURETSUDO BUI RICHIYAADO;JIYON DABURIYU SUTATSUFUOODO
分类号 G09F9/33;G09F9/00;H01L25/16;H01L51/50;H04N5/225 主分类号 G09F9/33
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