| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the deterioration of the flatness of a semiconductor wafer by providing a vacuum sucking support member for vacuum chucking the wafer in a container body for containing a plurality of the wafers. SOLUTION: A vacuum sucking support member 14 for vacuum chucking a semiconductor wafer 13 is provided at the one wall 11 of a container body 10 for containing the wafers. The member 14 has a support cylinder 15 extended at the center between the walls 11 and bent perpendicularly at the end and a suction port 16 for vacuum chucking the wafer 13 at the end. The cylinder 15 is connected to a suction passage 17 formed at the wall 11 and opened at the upper end of the wall 11, and its suction port 18 is connected to a vacuum pump. Thus, suction force is generated at the port 16 at the end of the member 14 to vacuum chuck the center of the surface of the wafer 13 at the opposite surface to the mirror surface side. Thus, even if it is etched, the flatness is not disturbed.</p> |
