| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to avoid the electrical contact of a semiconductor element with the leads of a lead frame. SOLUTION: Inner lead parts of a lead frame 104 are fixed on the surface, which is located in the peripheries of electrode pads 102, of a semiconductor element 101 via double-side adhesive tapes 103 to the electrode pads 102 provided on one side of the semiconductor element 101 and the above inner leads and the pads 102 are connected with each other through bonding wires 105. Outer lead parts of the frame 104 are subjected to bonding work so as to reach the rear of the element 101 and the point parts of the outer lead parts are adhered to the rear of the element 101 via double-side adhesive tapes 106 provided on the rears of the point parts.
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