发明名称 HANDOTAISHUSEKIKAIROSOCHI
摘要 PURPOSE:To prevent the disconnection of aluminum wiring at the second layer in a part which is stepped because of aluminum wiring at the first layer, by causing the thickness of aluminum wiring at the first layer to be thinner than that of aluminum wiring at the second layer. CONSTITUTION:Aluminum wiring Al 1 at the first layer is mounted on a layer insulation film 3 and aluminum wiring Al 2 at the second layer is mounted on the layer insulation film 4. In such a case, this device allows the thickness of wiring Al 1 to be thinner than that of wiring of Al 2. Then, a stepped part which is caused by wiring Al 1 at the base surface of wiring Al 2 becomes small. Thus, this situation serves the purpose of improving the step coverage of wiring Al 2 at the stepped part and accordingly, preventing the disconnection of wiring Al 2 at the stepped part.
申请公布号 JP2653444(B2) 申请公布日期 1997.09.17
申请号 JP19870235901 申请日期 1987.09.19
申请人 HITACHI SEISAKUSHO KK;HITACHI CHO ERU ESU AI ENJINIARINGU KK 发明人 TAKAHASHI YASUSHI;MATSURA NOBUMI;KOYAMA YOSHIHISA;MURANAKA MASAYA;KIMURA KATSUTAKA;MYAZAWA KAZUYUKI;ISHIHARA MASAMICHI
分类号 H01L23/52;H01L21/3205;H01L21/822;H01L21/8242;H01L27/04;H01L27/108 主分类号 H01L23/52
代理机构 代理人
主权项
地址