| 摘要 |
PURPOSE:To enhance geometrical intensity, release steam pressure, and prevent a resin crack from generating by a method wherein a width dimension of a pad side connection for fixing a semiconductor element in a pad supporter is wider than that of a package end side. CONSTITUTION:A pad supporter 17 of a semiconductor element fixing pad 12 is formed on the short side of the semiconductor element fixing pad and a pad supporter 18 is formed on the long side thereof, respectively. Also, in a shape of the pad supporters 17, 18, a width dimension of a pad side connection for fixing the semiconductor element of the pad supporters 17, 18, is twice or more as large as that of a package end side. Accordingly, steam pressure to be released from an adhesive for fixing the semiconductor element can readily be released outside through the interface of the pad supporters 17, 18 and a sealing resin 16. Thus, any resin crack at mounting a board can be prevented from generating. |
