| 摘要 |
PURPOSE:To make it possible to deposit a rough surface-like plating even near fine patterns and a plated resist by a method wherein the roughened surfaces of conductor circuits are formed of a roughening plating using a copper sulfate plating solution containing a specified component. CONSTITUTION:At least one kind selected from among an oxyethylene surface active agent, a sulfer compound and a safranine dye is used as a component (a) and chloride ions are used as a component (b). At least roughened surfaces 5 of conductor circuits 4, which are formed on the surface of a temporary substrate 1 using a plated resist by a plating method, are formed of a roughening plating using a copper sulfate plating solution containing at least the component (a) out of the components (a) and (b). Thereby, the deposition property of the roughening plating is improved and the roughening plating is deposited in fine grooves, which are pinched by the plated resist, of the circuits and even near the plated resist. |
