发明名称 Bonding tool having diamond head and method of manufacturing the same
摘要 A bonding tool (40) has a head portion (45) which consists essentially of vapor-deposited diamond, wherein a principal diamond crystal plane forming a head face (47) is a (111) plane. Such a head face has high hardness, and is hard to wear. In order to improve toughness of a bonding head which is mainly made of vapor-deposited diamond, a portion forming a head face consists essentially of high-purity diamond, and another portion supporting the head face consists essentially of low-purity diamond. The head face has high rigidity, while the portion supporting the head face has high toughness. In order to provide a bonding head portion which is mainly made of vapor-deposited diamond with electrical conductivity, a portion forming a head face consists essentially of polycrystalline diamond containing a relatively small amount of dopant, and another portion supporting this portion contains a large amount of dopant. The head portion having electrical conductivity can be heated by energization. In a tool employing a coating containing vapor-deposited diamond as a bonding head portion, the coating is formed by a complex of a metal or ceramics and vapor-deposited diamond, in order to improve strength of the coating and adhesion to a tool substrate. The metal or ceramics is closer in thermal expansion coefficient to the tool substrate than the diamond. <IMAGE>
申请公布号 EP0567124(B1) 申请公布日期 1997.09.17
申请号 EP19930106560 申请日期 1993.04.22
申请人 SUMITOMO ELECTRIC INDUSTRIES, LIMITED 发明人 TANABE, KEIICHIRO;TAKAHASHI, TOSHIYA;IKEGAYA, AKIHIKO;FUJIMORI, NAOJI
分类号 B23K20/02;C04B41/50;C04B41/85;H05K13/00;(IPC1-7):H01L21/603;C23C16/26;H01L21/00 主分类号 B23K20/02
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