| 摘要 |
<p>PURPOSE:To reduce the number of processes and eliminate residence of a workpiece by carrying a casing containing a lead frame after subjected to die-bonding to a wire bonding device through a pallet and circulating an empty casing pallet after completion of the process to the die bonding device. CONSTITUTION:A lead frame 1 with which a pallet is joined is contained in an empty casing (a) on a stage 17 of a die-bonding device 10, and returned to a pallet 3. Then, a casing (b) is fed to the stage 17. Such operation is repeated. The lead frame is carried to a casing changer 13 of a wire-bonding device 11 through a passage 21, and an empty casing on a stage 18 is returned and placed on the pallet 3. A casing (d) is sent to the stage 18, and the lead frame 1 is successively taken out and returned to the pallet 3, and further a casing (c) is sent. Such operation is repeated. On the other hand, an empty casing (g) is mounted on a stage 19, and thereafter the pallet 3 on which empty casing h, i, j and k are mounted is fed to a casing changer through a passage 22. After the empty casings are filled with pallets, they are discharged to a pallet storage 16.</p> |
