| 摘要 |
<p>PURPOSE:To absorb strain at the time of adhering a semiconductor sensor to a pedestal and a strain from the mounting surface. CONSTITUTION:Grooves 4, 5 are provided on the upper face on a lower part stopper wafer 2 (pedestal) of a semiconductor sensor wafer 1 and on the lower part of an upper part stopper wafer 3. A strain at the time of adhering the sensor wafer 1 to the stopper wafers 2, 3 is absorbed by the grooves 4, 5. Accordingly, the strain at the time of adhering the sensor wafer to the stopper wafers is absorbed by the grooves provided between the sensor wafer and the stopped wafers.</p> |
