| 发明名称 |
MOUNTING ELECTRONIC COMPONENTS TO A CIRCUIT BOARD |
| 摘要 |
The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer. |
| 申请公布号 |
EP0795200(A1) |
申请公布日期 |
1997.09.17 |
| 申请号 |
EP19950939966 |
申请日期 |
1995.11.13 |
| 申请人 |
FORMFACTOR, INC. |
发明人 |
KHANDROS, IGOR, Y.;MATHIEU, GAETAN, L.;ELDRIDGE, BENJAMIN, N.;GRUBE, GARY, W.;DOZIER, THOMAS, H. |
| 分类号 |
G01R1/073;H01R9/00;B23K1/00;B23K20/00;B23K31/02;C23C18/16;C25D5/08;C25D5/16;C25D5/22;C25D7/12;C25D21/02;G01R1/04;G01R1/06;G01R1/067;G01R31/26;G01R31/28;H01L21/00;H01L21/48;H01L21/56;H01L21/58;H01L21/60;H01L21/603;H01L21/607;H01L21/66;H01L21/68;H01L23/02;H01L23/12;H01L23/32;H01L23/48;H01L23/485;H01L23/49;H01L23/498;H01L23/538;H01L25/065;H01L25/07;H01L25/16;H01L25/18;H01R12/71;H01R13/05;H01R13/24;H01R29/00;H01R33/74;H01R33/76;H01R107/00;H05H1/18;H05K1/14;H05K1/18;H05K3/20;H05K3/24;H05K3/30;H05K3/32;H05K3/34;H05K3/36;H05K3/40;H05K7/10 |
主分类号 |
G01R1/073 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
