发明名称 POLYAMIDE FILM LAMINATE AND PACKING BODY FOR AIR CONTAINING BOIL
摘要 PROBLEM TO BE SOLVED: To form a polyamide laminate and a packing body air containing boil consisting of the laminate of good adhesiveness between a polyamide film and a sealant layer even during a moisture period and heat treatment such as an air containing boil finish. SOLUTION: The polyamide laminate is of a type having an adhesive-modified layer, an adhesive layer, and a sealant layer formed successively on at least one surface of a polyamide base material film, wherein at least one of the longitudinally directional stress when stretched by 75% in the longitudinal direction or the laterally directional stress when stretched by 75% in the lateral direction is 2.8×10<7> Pa or lower.
申请公布号 JPH09239929(A) 申请公布日期 1997.09.16
申请号 JP19960050627 申请日期 1996.03.07
申请人 TOYOBO CO LTD 发明人 KUZE KATSURO;MATSUDA NAGANARI;TAKEUCHI TOSHIAKI;MORISHIGE CHIKAO;ISAKA TSUTOMU
分类号 B05D5/10;B05D7/04;B29C55/12;B29K77/00;B29L9/00;B32B27/34;C08J7/04;(IPC1-7):B32B27/34 主分类号 B05D5/10
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