发明名称 |
POLYAMIDE FILM LAMINATE AND PACKING BODY FOR AIR CONTAINING BOIL |
摘要 |
PROBLEM TO BE SOLVED: To form a polyamide laminate and a packing body air containing boil consisting of the laminate of good adhesiveness between a polyamide film and a sealant layer even during a moisture period and heat treatment such as an air containing boil finish. SOLUTION: The polyamide laminate is of a type having an adhesive-modified layer, an adhesive layer, and a sealant layer formed successively on at least one surface of a polyamide base material film, wherein at least one of the longitudinally directional stress when stretched by 75% in the longitudinal direction or the laterally directional stress when stretched by 75% in the lateral direction is 2.8×10<7> Pa or lower. |
申请公布号 |
JPH09239929(A) |
申请公布日期 |
1997.09.16 |
申请号 |
JP19960050627 |
申请日期 |
1996.03.07 |
申请人 |
TOYOBO CO LTD |
发明人 |
KUZE KATSURO;MATSUDA NAGANARI;TAKEUCHI TOSHIAKI;MORISHIGE CHIKAO;ISAKA TSUTOMU |
分类号 |
B05D5/10;B05D7/04;B29C55/12;B29K77/00;B29L9/00;B32B27/34;C08J7/04;(IPC1-7):B32B27/34 |
主分类号 |
B05D5/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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