发明名称 |
IC component mounting method and apparatus |
摘要 |
An IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.
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申请公布号 |
US5667129(A) |
申请公布日期 |
1997.09.16 |
申请号 |
US19950432579 |
申请日期 |
1995.05.01 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MORITA, KOICHI;MISAWA, YOSHIHIKO;SAEKI, KEIJI;KABESHITA, AKIRA;WATANABE, NOBUHISA |
分类号 |
B23P21/00;H01L21/60;H05K13/04;H05K13/08;(IPC1-7):H01L21/58 |
主分类号 |
B23P21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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