发明名称 |
Ultrasonic wire bonding apparatus and method |
摘要 |
An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.
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申请公布号 |
US5667130(A) |
申请公布日期 |
1997.09.16 |
申请号 |
US19950382527 |
申请日期 |
1995.02.02 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MORITA, MAKOTO;NAGAIKE, MASARU;GUELER, RICHARD;IMANISHI, MAKOTO;YONEZAWA, TAKAHIRO |
分类号 |
H01L21/60;B23K20/00;H01L21/607;(IPC1-7):B23K20/10 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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