Low friction solder electrodeposits

摘要

The present invention relates to a solution and method for plating tin, lead, or tin-lead alloy deposits which contain a co-deposit of fluorocarbon particles to provide a lower-friction solder-type deposit which reduces insertion force and fretting corrosion in separable electronic connectors. The fluorocarbon particles have a size between about 0.1 to 1 mu m in diameter, and reduce the coefficient of friction of the resultant deposit to 0.8 or less. Also, the deposit has excellent mechanical properties and can be successfully soldered.