发明名称 MOLDING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To equally inject a resin into respective cavities by forming an auxiliary runner allowing mutually adjacent culls to communicate with each other so that the cross-sectional area thereof is larger than that of a main runner allowing the culls to communicate with the cavities. SOLUTION: After respective cavities 23 are filled with a liquid resin 31, the resin 31 is thermally cured to form a resin seal element. Upper and lower molds 21, 22 are opened and the resin seal element is released by an ejector pin. The work 1 having the resin seal element formed thereto is demolded from a transfer molding apparatus 20 by a handier. Tabs 3, pellets 4, inner leads 5a and bonding wires 6 become a resin sealed state within the molded resin seal element. A transfer molded object is molded from the transfer molding apparatus 20 and a runner part is separated from a multiple lead frame 2 having the resin seal element formed thereto by a molded product separator.
申请公布号 JPH09239790(A) 申请公布日期 1997.09.16
申请号 JP19960073303 申请日期 1996.03.04
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 SOBA TAKUMI;HATA HIDEKI;OGIWARA SAKAE;HIGUCHI AKIRA;SHIMIZU YOSHIHARU
分类号 B29C45/26;B29C45/02;B29C45/14;B29K101/10;B29L31/34;H01L21/56;(IPC1-7):B29C45/26 主分类号 B29C45/26
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