| 摘要 |
PROBLEM TO BE SOLVED: To produce a solventless composition, excellent in insulating properties and adhesion to a conductor layer and useful for production, etc., of a multilayerad wiring board without any breakage or short circuit of a wiring by dispersing a specific filler in the form of a particle or an aggregate in a specific matrix. SOLUTION: This solventless composition is obtained by dispersing (B) 1-300 pts.vol. filler which is a powder or a fiber of an inorganic substance, a powder of an organic substance or a fiber of an organic polymer (e.g. a cured epoxy resin having the biphenyl structure) in the form of a particle or an aggregate having <50μm particle diameter in (A) 100 pts.vol. matrix component which is a polymer (a precursor) (e.g. the one, deformable in a temperature region above ambient temperature and curable at a higher temperature then the temperature region, concretely a biphenyl-based epoxy resin) without using a solvent. The weight-average particle diameter of the component B is preferably regulated to <=10μm. |
