| 摘要 |
PROBLEM TO BE SOLVED: To surely transfer conductive resin paste to a bump at the time when a bare chip holding tool is expanded and contracted by measuring the minute change in the tool tip and controlling the tool tip position according to the measuring result. SOLUTION: Since in the process to transfer conductive resin paste 5 to the bump of the bare tip part 1 adsorbedly held at the tip of a tool 3, the tool 3 is expanded by length δ due to thermal expansion, the travel amount of the tool 3 from standard height must not be considered to be L2, initial setting amount, but to be L2-δ. Accordingly, when a control section 9 controls a motor 6 for vertically moving the tool 3 to correct the travel amount of the tool 3 from the standard height when transferring the conductive resin paste 5 to L2-δ, the conductive resin paste 5 can normally be transferred to the bump of the bare tip part 1. |
