发明名称 Semiconductor device with increased on chip decoupling capacitance
摘要 A semiconductor device has an on-board decoupling capacitor provided at its interconnect region. The decoupling capacitor comprises two layers of metallurgy separated by a dielectric layer wherein two of the layers are identically patterned.
申请公布号 US5668399(A) 申请公布日期 1997.09.16
申请号 US19960691626 申请日期 1996.08.02
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CRONIN, JOHN EDWARD;HILTEBEITEL, JOHN ANDREW
分类号 H01L27/04;H01L21/822;H01L23/522;H01L23/528;H05K1/16;(IPC1-7):H01L29/00;H01L23/48 主分类号 H01L27/04
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