发明名称 |
Semiconductor device with increased on chip decoupling capacitance |
摘要 |
A semiconductor device has an on-board decoupling capacitor provided at its interconnect region. The decoupling capacitor comprises two layers of metallurgy separated by a dielectric layer wherein two of the layers are identically patterned. |
申请公布号 |
US5668399(A) |
申请公布日期 |
1997.09.16 |
申请号 |
US19960691626 |
申请日期 |
1996.08.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CRONIN, JOHN EDWARD;HILTEBEITEL, JOHN ANDREW |
分类号 |
H01L27/04;H01L21/822;H01L23/522;H01L23/528;H05K1/16;(IPC1-7):H01L29/00;H01L23/48 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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