发明名称 Method for forming a semiconductor device electrode which also serves as a diffusion barrier
摘要 A capacitor element includes a pervoskite dielectric film and an electrode having excellent electrical contact characteristic and improved adhesion to an underlying surface. In a method for fabricating the electrode, a group IVB or VB refractory metal transition element is deposited on a silicon substrate or a silicon oxide layer. A group VIII near noble metal transition element is then deposited on the group IVB or VB refractory metal layer. The substrate and deposited layers is then subjected to a heat treatment in an ammonia ambient to form a refractory metal nitride layer between the refractory metal and near noble metal layers. In addition, if the refractory metal is deposited on a silicon substrate, a silicide layer is formed between the refractory metal layer and the substrate during heat treatment. If, however, the refractory metal layer is provided on a silicon oxide layer, a refractory metal oxide is formed during the heat treatment. Examples of group IVB refractory metal transition elements include Ti, Zr and Hf; examples of group VIII refractory metal transition elements include Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, and Pt; and examples of the group VB refractory metals include V, Nb, and Ta.
申请公布号 US5668040(A) 申请公布日期 1997.09.16
申请号 US19960601621 申请日期 1996.02.14
申请人 LG SEMICON CO., LTD. 发明人 BYUN, JEONG SOO
分类号 H01L21/02;(IPC1-7):H01L21/283 主分类号 H01L21/02
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