发明名称 Wire plating
摘要 PCT No. PCT/GB93/01933 Sec. 371 Date Oct. 31, 1995 Sec. 102(e) Date Oct. 31, 1995 PCT Filed Sep. 13, 1993 PCT Pub. No. WO94/26435 PCT Pub. Date Nov. 24, 1994In a method of continuously coating a conductive substrate such as brass wire to produce a desired cross-sectional size of coated material, the wire is drawn through a first die to produce an oversize wire, electroplate in a bath, and then drawn through a final die to reduce its area to the desired size and produce a controlled surface finish. The wire may be cleaned in an acid bath and rinsed in a rinsing bath prior to the electroplating bath. A further rinsing bath and dryer may be interposed upstream of the final die.
申请公布号 US5667661(A) 申请公布日期 1997.09.16
申请号 US19950545655 申请日期 1995.10.31
申请人 UNITED WIRE LIMITED 发明人 HUGHES, ANDREW
分类号 B21C1/00;C25D5/48;C25D7/06;(IPC1-7):C25D7/06;C25D5/10;C25D5/52;C25D17/00 主分类号 B21C1/00
代理机构 代理人
主权项
地址