| 摘要 |
<p>Providing encapsulated electronic components on a circuit board (14) by providing dams (30) on a circuit board around areas (32) on which respective electronic components (38) will be mounted, mounting the respective electronic components (38) within the dams (30) on the circuit board (14), and printing encapsulating material through a stencil (34) in order to provide deposits of encapsulating material over the electronic components (12) and within the dams (30).</p> |
