| 摘要 |
<p>A method for making electrical connections between a lead and a conductor on a substrate, the method including the steps of disposing a copper conductor on a ceramic substrate; positioning a lead in contact with the conductor; applying a copper film to the lead and the conductor to attach the lead to the conductor; and heating the substrate, lead and conductor assembly to secure bond the lead and conductor together. In a preferred embodiment, the conductor, lead and film are made of copper. The method can further include disposing a resistive film on the substrate using thin or thick film processes.</p> |
