LENS, SEMICONDUCTOR LASER ELEMENT, DEVICE FOR MACHINING THE LENS AND ELEMENT, PROCESS FOR PRODUCING SEMICONDUCTOR LASER ELEMENT, OPTICAL ELEMENT, AND DEVICE AND METHOD FOR MACHINING OPTICAL ELEMENT

摘要

A lens machining device is used for machining a lens which adjusts the optical characteristics of light outputted from a semiconductor laser element (10) to desired ones. The lens (12) to be machined is provided at one end section of the element (10) and the optical characteristics of the lens (12) are measured by means of the light transmitted through the lens (12) with a wave front measuring instrument (16). A machining laser beam is focused upon the surface of the lens (12) through a beam splitter (14). The surface of the lens (12) is machined with the laser beam while a position adjusting device (22) adjusts the positional relation between the surface of the lens (12) and the position where the laser beam is focused. An ultraviolet laser (18) and the position adjusting device (22) are controlled by a controlling arithmetic device (24). The device (24) calculates machining data that bring the optical characteristics of the light transmitted through the lens (12) closer to desired ones by using the measurement data of measuring instrument (16). When the lens is machined in such a way, the light transmitted through the lens (12) can have such optical characteristics that the shape of the light beam is a true circle.