Eine TAB-Packung und eine Flüssigkeitskristallplatte die diese Packung anwendet

摘要

A TAB package for packaging a semiconductor chip includes a flexible base plate (21) having a first surface and a second surface opposite to the first surface, an input (24) and output leads (25) being formed on the second surface of the flexible base plate and capable of being connected to the semiconductor chip (22), and a plurality of slits (27) being formed on the first surface of the flexible base plate. Accordingly, the TAB package is allowed to be easily bent and kept in the bending state. The slits are formed in a manner to correspond to the intervals between the adjacent input and output leads so that the input and output leads can be reliably supported by the flexible base plate.