发明名称 |
Verfahren zur Herstellung von mehrlagigen starr-flexiblen Leiterplatten |
摘要 |
A method for producing a hybrid multi-layered circuit substrate which utilizes prefabricated flexible printed circuit(s) which are rigidized in areas which define high density hybrid circuits. The hybrid circuit regions are formed by disposing copper-lined sheets on both surfaces of the flexible circuit, adhesively bonding the copper-lined sheets to the flexible circuit, forming through-hole conductors and etching a circuit pattern in the copper layer of the lined sheets. The copper-lined sheets are initially general coextensive in size and shape with the flexible circuit and are subsequently severed so that the copper-lined sheets remain only in the hybridized portions of the product. Separation is achieved by mechanically punching along predetermined boundaries and is facilitated by providing either any elongated narrow through-hole at the boundary of the hybrid circuit from which the flexible circuit will extend the end product or by forming a groove in the copper-lined sheets at such boundary. |
申请公布号 |
DE3822071(C2) |
申请公布日期 |
1997.09.11 |
申请号 |
DE19883822071 |
申请日期 |
1988.06.30 |
申请人 |
NIPPON MEKTRON, LTD., TOKIO/TOKYO, JP |
发明人 |
KAMEDA, EIICHI, USHIKU, IBARAKI, JP |
分类号 |
H05K3/46;B32B38/10;H05K3/00;H05K3/42;(IPC1-7):H05K3/46;H01L23/50;B32B31/18;B32B15/08;H05K1/00 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|