发明名称 |
Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
摘要 |
<p>The present invention relates to a boron nitride composition of particles of boron nitride and a nonionic surfactant for use as a filler with a distribution of agglomerates having an average particle size in the range of between 20-80 microns and to a molding compound having a high thermal conductivity of above at least 5 W/m DEG K. The molding compound comprises a polymer base material, a filler and a nonionic surfactant with the filler comprising boron nitride in a concentration of at least 60% by weight of said composition and wherein the nonionic surfactant is selected from the class consisting of carboxylic acid amides and carboxylic acid esters. <IMAGE></p> |
申请公布号 |
EP0794227(A2) |
申请公布日期 |
1997.09.10 |
申请号 |
EP19970103424 |
申请日期 |
1997.03.03 |
申请人 |
ADVANCED CERAMICS CORPORATION |
发明人 |
HILL, RICHARD FRANK;DAVANZO, STEPHEN PHILLIP |
分类号 |
C08K3/38;C01B21/064;C08K5/10;C08K5/20;C08L63/00;C08L101/00;H01L23/29;H01L23/31;H05K1/03;(IPC1-7):C08L63/00 |
主分类号 |
C08K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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