Plastic-molded-type semiconductor device

摘要

A plastic-molded-type semiconductor device comprises two semiconductor chips (1a, 1b) having main surfaces on which electrodes and circuits are formed and which face each other; a lead frame (2) placed between these two semiconductor chips (1a, 1b) and electrically connected to their electrodes; a plastic package (6) formed by plastic-sealing the above components; and wiring patterns (4) provided on the main surfaces of the semiconductor chips (1a, 1b) through the intermediation of insulating films (3). The wiring patterns (4) are electrically connected to the electrodes of the semiconductor chips (1a, 1b) and to the lead frame (2). With this structure, it is possible for two large-sized semiconductor chips (1a, 1b) having electrodes in their middle sections to be encased in a single, relatively thin package (6).