| 摘要 |
<p>PURPOSE:To provide a method of making wiring conductor on a circuit board, whereby a plated film can be formed uniformly on all the wiring conductors on the circuit board even in the case that an independent pattern not connected with the peripheral wiring conductor pattern exists in the wiring conductor pattern being made using metallic organic paste. CONSTITUTION:This is a method of making wiring conductors on a circuit board, which consists of a process of making a wiring conductor pattern on the circuit board by metallic organic past, a process of drying and baking the wiring conductor pattern being made, and a process of applying electrolytic plating to the surface of the wiring conductor pattern being baked, and in the said metallic organic paste is mixed in beforehand a metal nobler than the metal for forming an electrolytic plated film in the subsequent process.</p> |
