| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip support substrate used for manufacturing a small semiconductor package. SOLUTION: A hole is bored in a part of a polyimide film which serves as an outer connecting part 3. After a copper foil is bonded, an expansion wiring 2 is provided extending to an inner connecting part and the outer connecting part 3. The polyimide film provided with a copper foil is blanked into a frame by a blanking die, and a support substrate where a set or more of inner connecting parts, expansion wirings 2, and outer connecting parts are provided is prepared (a). A die bond film 4 is tentatively bonded to the semiconductor chip mounting region of the support substrate (b). A semiconductor chip 6 is bonded to the support substrate at a prescribed position by the use of the tentatively bonded die bond film 4. A gold wire is electrically connected between the electrode of the semiconductor chip 6 and the inner connecting part by bonding (c). The support substrate mounted with semiconductor chip 6 is loaded in a transfer molding die and sealed up with sealing epoxy resin 7 (d). A solder ball 8 is disposed on the outer connecting part 3 and melted (e), and lastly the support substrate mounted with the semiconductor chips 6 is separated into unit packages by a punch. By this setup, a semiconductor package small in size, free from package cracking, and excellent in reliability can be manufactured. |
