发明名称 Substrate processing method and substrate processing apparatus
摘要 The present invention provides a substrate processing method including the coating step of coating a processing liquid on an object to be processed in a first processing unit of a processing chamber having first and second processing units, the step of conveying the object from the first processing unit to the second processing unit, the rinse step of rinsing an unnecessary processing liquid remaining on a peripheral portion of the object in the second processing unit to remove the unnecessary processing liquid, and the exposure step of conveying the rinsed object to an exposure apparatus to perform exposure processing for the object, wherein a time from the end of the rinse step for one object to be processed to the end of the rinse step for a next object to be processed is shorter than a time required for the exposure step for the one object.
申请公布号 US5665200(A) 申请公布日期 1997.09.09
申请号 US19950524528 申请日期 1995.09.07
申请人 TOKYO ELECTRON LIMITED;TOKYO ELECTRON KYUSHU LIMITED;IWAKI CO., LTD. 发明人 FUJIMOTO, AKIHIRO;TAKEKUMA, TAKASHI;SONOBE, KIYOMI
分类号 G03F7/20;H01L21/00;(IPC1-7):H01L21/00 主分类号 G03F7/20
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