| 摘要 |
PROBLEM TO BE SOLVED: To restrain a module board from being warped so as to enable a resin-encapsulated power module to be improved in moisture resistance, reliability, and temperature cycle resistance. SOLUTION: An empty space 10' where encapsulating resin 9 is injected is demarcated with a module board and a frame 10, and the frame 10 is as thick as 11mm and high in rigidity, so that stress induced by a shrinkage in the sealing resin 9 when it is cured can be dispersed through the module body and the frame 10. Stress dispersed into the module body and the frame 10 are canceled with each other, so that stress can be surely lessened, and the module board is less warped. |
