发明名称 |
Prioritizing efforts to improve semiconductor production yield |
摘要 |
A method for identifying those process steps which produce "high risk" particulate contamination that is most likely to produce defects. The die positions of particulate deposits on a wafer are measured prior to and subsequent to a specific process step, to determine the die positions of particulate deposits introduced during that specific process step. Then, subsequent electrical tests of the wafer are used to determine which locations on the wafer contain faulty circuitry. The locations of particulate deposits introduced during the specific process step are then correlated to the locations of faulty circuitry. The result is a measure of the extent to which particulate deposits introduced during the specific process step contribute to reductions in yield of the manufacturing process.
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申请公布号 |
US5665609(A) |
申请公布日期 |
1997.09.09 |
申请号 |
US19950426711 |
申请日期 |
1995.04.21 |
申请人 |
SONY CORPORATION;SONY ELECTRONICS, INC. |
发明人 |
MORI, KIYOSHI |
分类号 |
H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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