| 摘要 |
PROBLEM TO BE SOLVED: To generate no blisters between a wiring conductor and a copper- plated layer and to strongly stick a plated layer by specifying a paladium content of a plated and covered layer consisting of copper so as to allow direct bonding to the plated layer. SOLUTION: Referring to a wiring substrate, because of specifying a paladium amount contained in a plated and covered layer consisting of copper to 0.1 to 10μm/cm<2> , paladium is not alloyed with copper of the plated and covered layer but solidly melted and diffused into the copper and hydrogen adsorbed by the paladium is relatively exhausted out of the group at a temperature of 600 to 700 deg.C thus having no danger of generating swelling. Accordingly, the plated and covered layer consisting of copper can be strongly stuck to a wiring conductor thus allowing direct wire bonding to the plated and covered layer and mounting with even a minute pad such as a flip chip land with no question thus becoming excellent in an anti-corrosive property and a solder corrosion property.
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