发明名称 |
Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode |
摘要 |
A bump electrode includes a core portion provided on an intermediate electrode layer formed on an electrode pad formed on a surface of an element. The core portion contains a material having a Young's modulus less than that of soldering. An electrically conductive film covers the core portion.
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申请公布号 |
US5666270(A) |
申请公布日期 |
1997.09.09 |
申请号 |
US19940280327 |
申请日期 |
1994.07.25 |
申请人 |
FUJITSU LIMITED |
发明人 |
MATSUDA, TATSUHARU;MINAMIZAWA, MASAHARU |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H05K7/20 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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