| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive polymer composition whose photosensitivity is good and whose property for smoothing an interconnection step is good by a method wherein an azide compound which comprises a carboxylic acid in a polyimide resin precursor of a specific composition is combined with a compound which comprises a plurality of carbon-carbon doublebonds. SOLUTION: A first interconnection layer on a substrate is coated and dried with photosensitive polymer composition which contains 100 pts.wt. of a polyimide-based resin precursor obtained in such a way that 1.6 to 2.0mol of 4C or lower monovalent alhohol is added to 1mol of an aromatic tetrabasic acid dianhydride and heated, that the tetrabasic diacid anhydride is changed into a diester and that 0.2 to 1mol of an amino compound expressed by formula (where R<1> represents an aromatic cyclic group and R<2> represents hydrogen or a C3 or lower hydrocarbon group) and 0 to 0.8mol of a diamine compound are reacted with the diester whose total amount becomes 1.0mol and 1 to 400 pts.wt. of a compound which comprises N3 R<3> COOH (where R<3> represents an aliphatic group or the like) and a plurality of carbon-carbon double bonds. Then, an interlayer insulating film and a second wiring layer are formed. |
