发明名称 COPOLYMERIZED POLYIMIDE, COPOLYMERIZED POLYIMIDE RESIN MOLDING AND THEIR PRODUCTION
摘要 PROBLEM TO BE SOLVED: To obtain a polyimide copolymer which can produce a molded product of high elastic modulus, low thermal expansion and low water absorption and is useful as a TAB base film by molecularly binding a specific block polyimide component to a randomly copolymerized polyimide component. SOLUTION: (A) A polyimide block component from an aromatic diamine of a rigid structure of formula I (X is H, a halogen, carboxyl, a lower alkyl, a lower alkoxy) such as p-phenylenediamine (A1 ) and an aromatic tetracarboxylic acid, for example, pyromellitic acid, 3,3',4,4'- biphenyltetracarboxylic acid or 3, 3',4,4'-benzophenone-tetracarboxylic acid (A2 ) and (B) a polyimide random copolymer component from an aromatic diamine of a flexible structure of formula II (Y is X; A is O, S, CO, SO, SO2 , CH2 ), for example, 4,4'-diaminodiphenyl ether (B1 ) and 2 or more kinds of A2 are molecularly bonded to each other.
申请公布号 JPH09235373(A) 申请公布日期 1997.09.09
申请号 JP19960354105 申请日期 1996.12.17
申请人 DU PONT TORAY CO LTD 发明人 SAWAZAKI KOICHI;KUBO MICHIHIRO;MATSUDA TOSHIKAZU
分类号 C08J5/00;C08G73/10;(IPC1-7):C08G73/10 主分类号 C08J5/00
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