发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To easily manufacture a semiconductor device of high transistor characteristics by a method wherein high-frequency transistors are formed by a master slice method. SOLUTION: A semiconductor device is equipped with transistors formed on a semiconductor chip 1 by a master slice method, wherein a transistor of minimum scale selected out of transistors manufactured by a master slice method is arranged as a main transistor cell 2 at the center of the semiconductor chip 1, and auxiliary transistor cells 3 and 4 are arranged symmetrically with respect to the main transistor cell 2.
申请公布号 JPH09237882(A) 申请公布日期 1997.09.09
申请号 JP19960041397 申请日期 1996.02.28
申请人 NEC CORP 发明人 TAKANO HIROSHI
分类号 H01L29/73;H01L21/331;H01L21/60;H01L21/82;H01L27/118;H01L29/732 主分类号 H01L29/73
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