| 摘要 |
PROBLEM TO BE SOLVED: To enhance the versatility and the reliability of a lead frame by a method wherein a suspension pin which is formed integrally with a lead is bonded to a semiconductor element in order to fix the semiconductor element. SOLUTION: In order to fix a semiconductor element 1, suspension pins 10 which are formed integrally with leads 4 are bonded to the semiconductor element 1. For example, dummy pads 11 are formed on a semiconductor element 1 in addition to electrode pads 3, and bumps 12 used to connect suspension pins 10 are formed on them. In addition, a bed is not formed on a lead frame. Further, leads 4 and suspension pins 10 are formed, and gold or solder is vapor- deposited in regions to be bonded to the bumps 12 at tip parts of the suspension pins 10. Then, the tip parts of the suspension pins 10 and the bumps 12 on the semiconductor element 1 are heated and compression-bonded, and the electrode pads 3 and the leads 4 are connected by wires 5. Then, the semiconductor element 1, the wires 5, a part of the leads 4 and a part of the suspension pins 10 are sealed with a resin 6. |
