| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a BGA(ball grid array) semiconductor device where heat released from a semiconductor chip is more efficiently dissipated by conducting it to a printed board mounted with the chip. SOLUTION: A semiconductor device is equipped with a board 31, a semiconductor chip 32, power supply solder balls 36P, and grounding solder balls 36G. The board 31 is provided with a rectangular opening 31a. The semiconductor chip 32 is possessed of signal pads 40S at its periphery, power supply pads 40P and grounding pads 40G located on its inner side and mounted on the board 31 making the signal pads 40D be electrically connected to the board 31 and the power supply pads 40P and the grounding pads 40G face on the rectangular opening 31a. The power supply solder balls 36P are directly connected to the power supply pads 40P. The grounding solder balls 36G are directly connected to the grounding pads 40G. Heat released from the semiconductor 32 is transferred to the printed board almost through the power supply solder balls 36P or the grounding solder balls 36G.</p> |
