| 发明名称 |
Polishing pad, polishing apparatus and polishing method |
| 摘要 |
A polishing pad comprises at least a first layer having a first main surface serving to polish a substrate to be polished and a second main surface, and a second layer positioned to face the second main surface of the first layer and having fine bags arranged therein, fluid being hermetically sealed in the fine bag. |
| 申请公布号 |
US5664989(A) |
申请公布日期 |
1997.09.09 |
| 申请号 |
US19960683265 |
申请日期 |
1996.07.18 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NAKATA, REMPEI;KANEKO, HISASHI;HAYASAKA, NOBUO;NISHIOKA, TAKESHI;TATEYAMA, YOSHIKUNI;NAKANO, YUTAKA;SASAKI, YASUTAKA |
| 分类号 |
B24B37/00;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24D13/14;C08J5/14;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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