发明名称 HEAT-SENSITIVE STENCIL PRINTING BASE PAPER AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To lower the necessity of energy for perforating at the time of stencil printing, provide the high image density and improve the resistance to printing by forming an island-shaped pattern composed of a vinyl chloride/vinyl acetate copolymer on one face of a heat-sensitive perforation film. SOLUTION: A thermoplastic resin film 2 manufactured by the orientation method of a heat-sensitive stencil layer is laminated with an ink permeable base layer by a bonding material and used for a heat-sensitive stencil printing paper. In that case, an island-shaped pattern 1 composed of a vinyl chloride/vinyl acetate copolymer is formed on one face of the thermoplastic resin film 2. If necessary, a diazonium compound and silica of oil absorption amount of 190ml/g-300ml/g are contained in the vinyl chloride/vinyl acetate copolymer, and silica of particle diameters of 1-30μm is used. As the heat-sensitive perforative film 2, a resin film of heat shrinkage stress of 75-550g/mm<2> at 100 deg.C and crystallinity of 5% or less is used.
申请公布号 JPH09234968(A) 申请公布日期 1997.09.09
申请号 JP19960071133 申请日期 1996.03.01
申请人 RICOH CO LTD 发明人 TOSHIMOTO MASANORI;TANIGUCHI KEIJI
分类号 B41N1/24;B29C61/06;B29K67/00;(IPC1-7):B41N1/24 主分类号 B41N1/24
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